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Layer Count: 16
Surface finishing: ENIG
Board thickness: 1.60 mm
Min. finish hole: 0.25 mm
Min. line width and spacing: 3 mil
Soldermask: Green
Special features: Plugged via,Gold tab
 
Layer Count: 12
Surface finishing: ENIG
Board thickness: 1.6 mm
Min. finish hole: 0.30 mm
Min. line width and spacing: 4 mil
Soldermask: Green
Special features: Plugged via
Layer Count: 10
Surface finishing: ENIG
Board thickness: 1.6 mm
Min. finish hole: 0.35 mm
Min. line width and spacing: 6 mil
Soldermask: Green
Special features: Plugged via
 
Layer Count: 6
Surface finishing: ENIG
Board thickness: 1.0 mm
Min. finish hole: 0.20 mm
Min. line width and spacing: 4 mil
Special features: Blind vias, BGA
Layer Count: 2
Surface finishing: ENIG
Special features: Peelable mask
 
Layer Count: 6
Surface finishing: Lead Free HASL
Copper thickness: 2 oz (All layer)
Soldermask: Red
Layer Count: 4
Surface finishing: Plating Gold
(Au 0.03um, Ni 4.5um)
Board thickness: 0.80 mm
Min. finish hole: 0.30 mm
Special features: Plugged via
 
Layer Count: 2
Surface finishing: Lead Free HASL
Copper thickness: 2 oz (All layer)
Soldermask: Black
Layer Count: 6
Surface finishing: Plating Gold
(Au 0.03um, Ni 4.5um)
Copper thickness: 0.5 oz
Board thickness: 0.60 mm
Min. finish hole: 0.30 mm
Min. line width and spacing: 4 mil
Special features: Plated half hole, Plugged via
 
Layer Count: 6
Surface finishing: Immersion Tin
Min. finish hole: 0.30 mm
Min. line width and spacing: 4 mil
Layer Count: 4
Surface finishing: Lead Free HASL
Board thickness: 3.2 mm
Copper thickness: 3 oz (All layer)
Special features: Selective gold plating (Au 0.585um, Ni 3.0um)
 
Layer Count: 4
Board thickness: 1.6 mm
Surface finishing: Lead Free HASL
Soldermask: Black
Layer Count: Single Side
Board thickness: 3.0 mm
Surface finishing: Lead Free HASL
Special features: Aluminum Based
 
Layer Count: Single Side
Board thickness: 3.0 mm
Surface finishing: Lead Free HASL
Special features: Aluminum Based
Layer Count: 4
Surface finishing: Lead Free HASL
Copper thickness: 4 oz (All layer)
 
Layer Count: 8
Surface finishing: OSP
Board thickness: 1.2 mm
Min. finish hole: 0.20 mm
Min. line width and spacing: 3 mil
Soldermask: Blue
Special features: Blind vias,BGA,Gold tab (Au 0.36um,
Ni 3.23um)
Layer Count: Single Side
Surface finishing: ENIG
Board thickness: 1.6mm
Special features: Aluminum Based
 
Layer Count: 4
Surface finishing: ENIG
Soldermask: Blue
Special features: Selective gold plating (Au 2 um, Ni 5 um)
Layer Count: 6
Surface finishing: OSP
Board thickness 1.0 mm
Min. finish hole: 0.3 mm
Min. line width and spacing: 3 mil
Soldermask: Red
Special features: Plugged via
 
Layer Count: 6
Surface finishing: OSP
Soldermask: White
Special features: Carbon Ink
Layer Count: 4
Surface finishing: Immersion Silver
Copper thickness: 3 oz
(Outer layer), 2 oz (Inner layer)
 
Layer Count: 4
Board thickness: 1.5 mm
Surface finishing: OSP
Special features: Impedance Control 80 ohm ± 10%,
Halogen Free Laminate
Layer Count: 4
Board thickness: 1.6 mm
Surface finishing: OSP
Special features: Impedance Control 100 ohm ± 10%
 
Layer Count: 2
Board thickness: 0.5 mm
Surface finishing: Plating Gold
(Au 0.2um, Ni 3~5um)
Soldermask: White
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